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Automatic Circuit Board Lamination Press

Press Molding: 200 Ton Vacuum Compression Molding Presses & C Frame Press Designs

Custom Automatic Lamination Press for Circuit Boards TMP, A Division of French recently developed a multi-purpose, 300-ton vacuum automatic hydraulic lamination system for the printed circuit board industry that allows research development with high-end experimental material, product samples and small run production capabilities. The specialized, electrically heated platens allow high temperature molding, up to 750ºF,…

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